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| Product Name: |
Back Grinding Wheel
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| Supply Ability: |
$5million |
| Related proudcts |
integrated circuit, silicon wafer, |
| Specifications |
6A2 175/195/209/305/255/355 |
| Price Term: |
FOB |
| Port of loading: |
XI'an |
| Minimum Order |
>0 |
| Unit Price: |
>0 |
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| Back Grinding Wheel is mainly used in a Semiconductor Wafer Thinning and finishing. |
| Company: |
XI'AN QINLING DIAMOND GRINDING WHEEL CO.,LTD
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| Contact: |
Ms. zhang juana |
| Address: |
2-10202Room ,Eastern District Of Modern Enterprise Center,No.2 ZhangBaWu RD.,Hi-Tech Development Zone |
| Postcode: |
710077 |
| Tel: |
862968590683 |
| Fax: |
862968590595 |
| E-mail: |
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